FLIM TYPE SEMICONDUCTOR PACKAGE WITH LEAD CHANGED SHAPE AND JOINING STRUCTURE OF THE LEAD AND BUMP

摘要

Protrusion-bonding structure of film-type semiconductor package and the deformation for leading to the shape for disclosing lead. It is equipped with the film-type semiconductor package of basal film, an integrated circuit chip, multiple raised and multiple lead according to an embodiment of the present invention with the variation of a lead format. Basal film be provided with it is multiple at one end on output lead and multiple inputs of the other end are grouped. One integrated circuit chip is installed on basal film. By a predetermined altitude, multiple protrusions are arranged on the active surface of integrated circuit chip prominent. Multiple lead are electrically connected to integrated circuit chip by protrusion and input/output is followed closely. La wherein have a common boundary and engage by the protrusion of region and lead, lead/output lead mouth and when head harness interconnecting piece is for connection bump unit length, the region of the joint area unit length bigger than connection. Film to pressure to lead shape according to the present invention wherein semiconductor packages and protrusion lead it is glued by increase protrusion and lead junction area and by modify lead boundary shape and the connection between lead and protrusion protrusion structure enhance, phenomenon of guarding against deviations have the advantage that increase film-type semiconductor package assembly process yield.