CONDUCTIVE BASE MATERIAL WITH THIN FILM RESISTANCE LAYER, METHOD OF PRODUCTION OF CONDUCTIVE BASE MATERIAL WITH THIN FILM RESISTANCE LAYER, AND CIRCUIT BOARD WITH THIN FILM RESISTANCE LAYER

摘要

A conductive base material with a thin film resistance layer, a method for manufacturing the conductive base material, and a circuit board having the thin film resistance layer are provided to reduce a variation in resistance of the thin film resistance layer by adjusting the thin film resistance layer using a thermal process. A conductive base material contains a thin film resistance layer. The thin film resistance layer is made of nickel containing phosphor. The thin film resistance layer is a thin film layer containing a mixture of crystalline and non-crystalline materials. The thin film resistance layer includes a Ni-plating layer, which contains phosphor. The Ni-plating layer is heat treated, such that both crystalline and non-crystalline materials are contained in the thin film resistance layer. The heat treatment process is performed at a temperature between 100 and 700°C.