Polyimide for producing a copper clad laminate and a manufacturing method for the same are provided to secure favorable dimensional stability, tear resistance, flex resistance, and transparency of the copper clad laminate. The method for manufacturing copper clad laminates for a flexible printed circuit board comprises the steps of: producing a polyamic acid solution by dissolving and reacting aromatic tetracarboxylic dianhydrides and aromatic diamine in a polar aprotic solvent without adding an inorganic filler; applying the polyamic acid solution on a copper foil; and forming a polyimide layer on the copper foil by heating the polyamic acid solution with continuing amidation reaction. The polyimide layer has a thermal expansion coefficient of 10~30ppm/‹C. The aromatic tetracarboxylic dianhydride is at least one selected from a group comprising biphenyl tetracarboxylic dianhydride, pyromellitic dianhydride, and benzophenone tetracarboxylic dianhydride.
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