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EXPOSURE EQUIPMENT HAVING A WAFER PRE-ALIGNMENT UNIT AND WAFER PRE-ALIGNMENT METHOD USING THE SAME
EXPOSURE EQUIPMENT HAVING A WAFER PRE-ALIGNMENT UNIT AND WAFER PRE-ALIGNMENT METHOD USING THE SAME
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机译:具有晶片预对准单元的曝光设备和使用晶片预对准单元的晶片预对准方法
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摘要
Exposure equipment with a wafer pre-alignment unit and a wafer pre-aligning method using the same are provided to reduce an aligning time by decreasing a flat zone detecting time of a wafer using a central controller and a determination controller. Exposure equipment includes a plurality of exposure apparatuses(100), a central controller and a determination controller. The central controller(200) is used for calculating the value of a misaligned angle of each wafer flat zone, correcting the misaligned angle of the flat zone, loading wafers into the exposure equipment and making the wafers be exposed. The determination controller(230) is electrically connected with the central controller. The determination controller is used for checking whether the wafers of the selected exposure apparatus are prepared for an initial exposure process or not. When the wafers are already performed with the initial exposure process, another exposure apparatus is selected.
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