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Method for enabling conventional wire bonding to copper-based bond pad features
Method for enabling conventional wire bonding to copper-based bond pad features
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机译:用于将常规引线键合到铜基焊盘特征的方法
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摘要
A method is described comprising removing an oxide from a surface and then commencing application of a passivation layer to the surface within 5 seconds of the oxide removal. The surface may be a copper surface which may further comprise a bonding pad surface. Removing the oxide may further comprise applying a solution comprising citric acid or hydrochloric acid. Applying the passivation layer may further comprise applying a solution comprising a member of the azole family where the azole family member may further comprise BTA. The method may also further comprise completely applying the passivation layer 35 seconds after commencing its application.
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