ORGANIC SOLDERABILITY PRESERVATIVES ON SOLDER PAD FOR MICROELECTRONIC PACKAGE APPLICATIONS AND PREPARATION METHOD THEREOF

摘要

A microelectronic package substrate is provided to secure good quality and be mass-produced by using an organic solderability preservative having more excellent high-temperature stability than the conventional organic solderability preservative. A microelectronic package substrate is manufactured by using a poly(4-vinyl pyridine-co-ally amine) of the following formula 1 or a poly(4-vinyl pyridine-co-acryl amide) of the following formula 2 as an organic solderability preservative. The polymer for organic solderability preservatives has a molecular weight of 300-30,000. The organic solderability preservative is prepared by adding a radical initiator to a mixture of 4-vinyl pyridine and allyl amine or acryl amide to polymerize the admixture.