Microelectronic packages having texturized solder pads and methods for the fabrication thereof

摘要

Microelectronic packages and methods for fabricating microelectronic packages having texturized solder pads, which can improve solder joint reliability, are provided. In one embodiment, the method includes forming a texturized dielectric region having a texture pattern, such as a hatch pattern, in an under-pad dielectric layer. A texturized solder pad is produced over the texturized dielectric region. The texturized solder pad has a solder contact surface to which the texture pattern is transferred such that the area of the solder contact surface is increased relative to a non-texturized solder pad of equivalent dimensions.