首页> 外文会议>Electronic Components and Technology Conference, 2002. Proceedings. 52nd >Reaction kinetics of Pb-Sn and Sn-Ag solder balls with electroless Ni-P/Cu pad during reflow soldering in microelectronic packaging

【24h】

Reaction kinetics of Pb-Sn and Sn-Ag solder balls with electroless Ni-P/Cu pad during reflow soldering in microelectronic packaging

机译：微电子封装中Pb-Sn和Sn-Ag焊料球与化学镀Ni-P / Cu焊盘的回流动力学

获取原文

页面导航

著录项
相似文献
相关主题

著录项

来源
《Electronic Components and Technology Conference, 2002. Proceedings. 52nd 》|2002年|P.1650-1657|共8页
会议地点
作者
Alam M.O.; Chan Y.C.; Hung K.C.;
展开▼
作者单位

展开▼
会议组织
原文格式 PDF
正文语种
中图分类无线电电子学、电信技术 ;
关键词

相似文献

外文文献
中文文献
专利

1. Interfacial Reaction of Pb-Sn Solder and Sn-Ag Solder with Electroless Ni Deposit during Reflow [J] . M.O. Alam, Y.C. Chan, K.C. Hung Journal of Electronic Materials . 2002 ,第10期

机译：回流期间Pb-Sn焊料和Sn-Ag焊料与化学镀镍的界面反应
2. Comparative Study of Interfacial Reactions of Sn-Ag-Cu and Sn-Ag Solders on Cu Pads during Reflow Soldering [J] . Ahmed Sharif, Y.C.Chan Journal of Electronic Materials . 2005 ,第1期

机译：回流焊接过程中Sn-Ag-Cu和Sn-Ag焊料在Cu焊盘上的界面反应的比较研究
3. Reaction Kinetics of Solder-Balls with Pads in BGA Packages during Reflow Soldering [J] . HO C.E., CHEN Y.M., KAO C.R. Journal of Electronic Materials . 1999 ,第11期

机译：BGA封装中的锡球与焊盘的回流焊动力学
4. Reaction kinetics of Pb-Sn and Sn-Ag solder balls with electroless Ni-P/Cu pad during reflow soldering in microelectronic packaging [C] . Alam M.O., Chan Y.C., Hung K.C. Electronic Components and Technology Conference, 2002. Proceedings. 52nd . 2002

机译：微电子封装中Pb-Sn和Sn-Ag焊料球与化学镀Ni-P / Cu焊盘的回流动力学
5. Investigation and analysis on the solder ball shear strength of plastic ball grid array, chip scale, and flip chip packages with eutectic lead-tin and lead-free solders. [D] . Huang, Xingjia. 2003

机译：用共晶铅锡和无铅焊料对塑料球栅阵列，芯片规模和倒装芯片封装的焊球剪切强度进行调查和分析。
6. Effect of Multiple Reflows on the Interfacial Reactions and Mechanical Properties of an Sn-0.5Cu-Al(Si) Solder and a Cu Substrate [O] . Junhyuk Son, Dong-Yurl Yu, Yun-Chan Kim, 2021

机译：多重回流对Sn-0.5Cu-Al（Si）焊料和Cu基质的界面反应和力学性能的影响
7. Intermetallic compounds formed during the reflow and aging of Sn-3.8Ag-0.7Cu and Sn-20In-2Ag-0.5Cu solder ball grid of Sn-3.8Ag-0.7Cu and Sn-20In-2Ag-0.5Cu solder ball grid array packages [O] . M. D. Cheng, S. Y. Chang, S. F. Yen, 2004

机译：在Sn-3.8Ag-0.7Cu和Sn-20英寸-2Ag-0.5Cu焊球栅格的回流和老化期间形成的金属间化合物在SN-3.8AG-0.7CU和SN-20IN-2AG-0.5CU焊球栅格阵列套件

Reaction kinetics of Pb-Sn and Sn-Ag solder balls with electroless Ni-P/Cu pad during reflow soldering in microelectronic packaging

著录项

相似文献

相关主题

期刊订阅