Copper plating method for electrolytic filling of blind bores

摘要

Copper plating method for electrolytic filling of blind bores (13) in a more compartment layer substrates, comprising the steps offor carrying out a chemical coppering an inner wall of the blind bores (13) and for carrying out a subsequent two-stage electrolytic filling of the blind bores (13), wherein in the case of a first stage of the two-stage electrolytic filling a low current density is used and in the case of the second stage of the two-stage electrolytic filling a higher current density is used,characterized in thatthe first stage of the same current as a deposition with a current density of less than or equal to 1,5 a / dm² up to a thickness of at least 1 μm is carried out andthe second stage, as a pulse metallization in the case of an average current density of approximately 3 a / dm² and in the case of a ratio of the cathodic to anodic current i1 / i2 of 1 / 2 to 1 / 5 and a pulse times ratio t1 / t2 of 5 / 1 to 30 / 1 is carried out.