Semiconductor device based on a lead-on-chip architecture, its manufacture and a lead frame for implementation in a semiconductor device

摘要

A semiconductor device having a first side that extends along a first direction and a second side that extends along the first direction. The semiconductor device includes a chip that has an edge and contacts that are arranged on a surface of the chip in the vicinity of the edge. The semiconductor device further includes a lead frame that includes a plurality of leads, the leads having a board level contact portion, an intermediate portion, and a chip level contact portion, the intermediate portion being disposed between the board level contact portion and the chip level contact portion. The board level contact portions extend from the first side or the second side of the semiconductor device along a second direction. The chip plane contact sections extend along the first direction. Ends of the chip plane contact portions are aligned along a line that runs in the second direction. Surfaces of the plurality of leads are disposed on portions of the surface of the chip, with the contacts of the chip near the ends of the chip plane contact portions of the plurality of leads. The contacts of the chip are connected to the chip level contact sections of the plurality of connection lines. The chip and the lead frame are encapsulated with potting compound and form a ...