Process to recover high-purity silicon material from laser etching in polycrystalline form

摘要

A combined laser/fluid etching process applied to high-purity silicon wafer material. The fluid contains a halogen agent and removes liberated high-purity silicon wafer material. In a process to recover the silicon, the fluid is distilled, condensed and recovered in polycrystalline form or by deposit on another substrate. In a final stage, halogens are driven from the recovered solids.