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Wafer test unit has base plate with test circuit and groups of electrically conductive springs to contact the wafer
Wafer test unit has base plate with test circuit and groups of electrically conductive springs to contact the wafer
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机译:晶圆测试单元具有带测试电路的底板和成组的导电弹簧以接触晶圆
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摘要
A wafer test unit (20) comprises a baseplate (30) with a test circuit and a group of electrically conductive springs across the width of the plate that are connected to the test circuit. Each spring presents an interface for a wafer test at the wafer test card. An independent claim is also included for a further test unit as above having measuring feelers at the spring ends.
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