首页> 外国专利> Method for producing angled printed circuit board structure involves production of level printed circuit board comprising at least one conductor, which is embedded to great extent in printed circuit board

Method for producing angled printed circuit board structure involves production of level printed circuit board comprising at least one conductor, which is embedded to great extent in printed circuit board

机译:用于制造成角度的印刷电路板结构的方法包括制造包括至少一个导体的水平印刷电路板,该导体至少很大程度上嵌入印刷电路板中

摘要

The method involves production of a level printed circuit board (1) comprising at least one conductor (4), which is embedded to a great extent in the printed circuit board. The conductor extends between two regions of the printed circuit board that are configured as connection points (6) and is connected to the latter in an electrically conductive manner. The two regions that are configured as connection points being located on different printed circuit board sections (12,14,16,18,20,22). Provision of at least one region that is designed to be angled, preferably an edge (28) between the printed circuit board sections. The circuit board sections can be angled in relation to one another, while retaining the conductor connection between the regions that are configured as connection points by bending the conductor. Independent claims are also included for the following: (A) Printed circuit board; (B) Angled printed circuit board; and (C) Spatial printed circuit board.
机译:该方法包括生产包括至少一个导体(4)的水平印刷电路板(1),该导体在很大程度上嵌入印刷电路板中。导体在印刷电路板的构造为连接点(6)的两个区域之间延伸,并且以导电的方式连接到后者。被配置为连接点的两个区域位于不同的印刷电路板部分(12,14,16,18,20,22)上。在印刷电路板部分之间提供至少一个设计成一定角度的区域,优选为边缘(28)。电路板部分可以相对于彼此成一定角度,同时通过弯曲导体来保持被配置为连接点的区域之间的导体连接。还包括以下方面的独立权利要求:(A)印刷电路板; (B)成角度的印刷电路板; (C)空间印刷电路板。

著录项

  • 公开/公告号DE202006019817U1

    专利类型

  • 公开/公告日2007-05-16

    原文格式PDF

  • 申请/专利权人 JUMATECH GMBH;

    申请/专利号DE202006019817U1

  • 发明设计人

    申请日2006-01-24

  • 分类号H05K3/40;H05K1/14;

  • 国家 DE

  • 入库时间 2022-08-21 20:28:57

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