首页> 外国专利> Method for processing of printed circuit board of printed circuit board panel, involves providing printed circuit board panel with printed circuit board and printed circuit board is provided with marking position

Method for processing of printed circuit board of printed circuit board panel, involves providing printed circuit board panel with printed circuit board and printed circuit board is provided with marking position

机译:印刷电路板面板的印刷电路板的处理方法,包括为印刷电路板面板提供印刷电路板,并且在印刷电路板上设置标记位置

摘要

The method involves providing a printed circuit board panel (2) with a printed circuit board (PCB) (4). The PCB is provided with a marking position. The releasing or covering of marking position of the PCB, depends on the processing or non-processing of the PCB by a pre-determined processing program. A detection device detects the released or covered marking position of the PCB. The processing program is designed on the basis of marking position of the PCB, which is covered or released. An independent claim is also included for a printed circuit board with a marking position.
机译:该方法包括为印刷电路板面板(2)提供印刷电路板(PCB)(4)。 PCB具有标记位置。 PCB标记位置的释放或覆盖取决于预定处理程序对PCB的处理或不处理。检测设备检测PCB释放或覆盖的标记位置。根据覆盖或释放的PCB标记位置设计处理程序。具有标记位置的印刷电路板也包括独立权利要求。

著录项

  • 公开/公告号DE102006058569A1

    专利类型

  • 公开/公告日2008-06-26

    原文格式PDF

  • 申请/专利权人 SIEMENS AG;

    申请/专利号DE20061058569

  • 发明设计人 ZOLLNER THOMAS;

    申请日2006-12-12

  • 分类号H05K13/02;H05K1/02;

  • 国家 DE

  • 入库时间 2022-08-21 19:49:34

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