A method for making electrolytically deposited copper foil, electrolytically deposited copper - film, copper clad laminate and the printed circuit board.

摘要

A process for producing an electrodeposited copper foil, comprising electrodepositing a copper foil from an electrolyte containing copper sulfate dissolved therein, in which said electrolyte contains a small amount of lead (Pb) ions, which comprises adding a salt of a metal of group IIA of the periodic table to the electrolyte in an amount of 10 to 150 mol per mol of lead (Pb) ions contained in the electrolyte so that the lead (Pb) ions contained in the electrolyte react with the metal of group IIA of the periodic table to thereby form an insoluble composite substance to precipitate, said insoluble composite substance followed by removing it from the electrolyte and forming an electrodeposited copper foil in the electrolyte having the lead (Pb) ions removed therefrom.