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Substrate fabrication by bonding a useful element of a first material to a support of a second material with the deposition of an interposed amorphous layer
Substrate fabrication by bonding a useful element of a first material to a support of a second material with the deposition of an interposed amorphous layer
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机译:通过将第一种材料的有用元素粘合到第二种材料的支撑体上并沉积一层非晶层的方法来进行衬底制造
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摘要
Techniques are shown in which substrates having a first layer of a first material and second layer of a second material, wherein the second material is less noble than the first material, is provided by bonding the first and second layers together with an amorphous layer interposed there between. The amorphous material may be deposited on a bonding face of the first layer, second layer, or both, before the operation of bonding the first and second layers. The layer with less noble material may be a supporting layer and the other layer may be an active layer for forming components in optics, electronics, or opto-electronics. The amorphous layer may be polished before the bonding operation.
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