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cmp procedures for the implementation of the second polierschrittes in kupferlagen with oxidant free polierflu00fcssigkeit
cmp procedures for the implementation of the second polierschrittes in kupferlagen with oxidant free polierflu00fcssigkeit
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机译:使用无氧化剂的抛光液在铜层中执行第二抛光步骤的cmp程序
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摘要
A polishing fluid for second step barrier removal polishing in copper CMP that contains no oxidizing agent, an organic acid, an abrasive and optionally, a copper corrosion inhibitor shows a high selectivity of barrier to metal and barrier to insulating layer.
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