首页> 外国专利> mutterplatinenanordnung with a single base for inclusion of a single integrated schaltungspackung or more integrated schaltungspackungen

mutterplatinenanordnung with a single base for inclusion of a single integrated schaltungspackung or more integrated schaltungspackungen

机译:具有单个基座的mutterplatinenanordnung,可包含单个集成的schaltungspackung或更多个集成的schaltungspackungen

摘要

A motherboard assembly which has an integrated circuit socket that can be mated with either a single integrated circuit package or a multiple integrated circuit package module. The motherboard has a socket connector which can receive the external pins of an integrated circuit package. The motherboard also has an auxiliary connector that can mate with a corresponding connector-mounted to a daughterboard. Mounted to the daughterboard are a first integrated circuit package and a second integrated circuit package. Each package may contain a multi-processing microprocessor. The first integrated circuit package has a plurality of pins that mate with the socket connector. The daughterboard can be coupled to the motherboard by pressing the external pins of the first integrated circuit package into the socket connector and mating the auxiliary connectors. The present invention allows a plurality of processors to be plugged into a single socket without occupying a significant amount of space on the motherboard.
机译:具有可与单个集成电路封装或多个集成电路封装模块配合的集成电路插座的母板组件。母板具有一个插座连接器,可以容纳集成电路封装的外部引脚。母板还具有一个辅助连接器,可以与安装在子板上的相应连接器配合。第一集成电路封装和第二集成电路封装安装在子板上。每个包装可以包含一个多处理微处理器。第一集成电路封装具有与插座连接器配合的多个引脚。通过将第一集成电路封装的外部引脚压入插座连接器并配合辅助连接器,可以将子板耦合至母板。本发明允许将多个处理器插入单个插座中,而不占用主板上的大量空间。

著录项

  • 公开/公告号DE69636699D1

    专利类型

  • 公开/公告日2006-12-28

    原文格式PDF

  • 申请/专利权人 INTEL CORP.;

    申请/专利号DE19966036699T

  • 发明设计人 BEGIS GLENN;

    申请日1996-03-18

  • 分类号H05K1/14;G06F13/40;H05K3/36;H05K7/02;

  • 国家 DE

  • 入库时间 2022-08-21 20:27:30

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