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ELECTROFORMING MOLD, METHOD OF MANUFACTURING ELECTROFORMING MOLD AND METHOD OF MANUFACTURING ELECTROFORMED COMPONENT

机译:电铸模,制造电铸模的方法和制造电铸组件的方法

摘要

PROBLEM TO BE SOLVED: To provide an electroforming mold by which a plurality of electroformed components different in thickness are manufactured without dividing the electroforming mold and each of components has an electrode on the bottom surface, and to provide a method of manufacturing the electroforming mold.;SOLUTION: The electroforming mold 101 includes a conductive layer 2, many resin layers which is formed on the conductive layer, an intermediate conductive film 5a interposed among the many resin layers, and a plurality of cavities having side walls each surrounded by the resin, wherein the plurality of the cavities comprises a first cavity C1 having a depth penetrating through the whole many resin layers, a second cavity C2 having a depth penetrating through a partial layers in the many resin layers and a switching cavity S having a stepwise structure in every many resin layers, the conductive layer 2 is exposed on the bottom surface of the first cavity C1, the intermediate conductive film 5a is exposed on the bottom surface of the second cavity C2, the conductive layer 2 is exposed on the bottom surface of the switching cavity S, and the intermediate conductive film 5a is exposed on each resin layer having the stepwise structure.;COPYRIGHT: (C)2008,JPO&INPIT
机译:解决的问题:提供一种电铸模具,通过该电铸模具制造厚度不同的多个电铸部件而不分割电铸模具,并且每个部件的底表面上均具有电极,并且提供一种电铸模具的制造方法。 ;解决方案:电铸模具101包括一个导电层2,在该导电层上形成的许多树脂层,插入在许多树脂层之间的中间导电膜5a和多个腔体,每个腔体的侧壁均被树脂包围,其中,多个腔体包括具有贯穿全部多个树脂层的深度的第一腔室C1,具有贯穿多个树脂层中的部分层的深度的第二腔室C2以及在每个腔室中均具有阶梯结构的切换腔室S在许多树脂层中,导电层2暴露在第一腔C1的底表面上,中间层导电膜5a暴露在第二腔C2的底表面上,导电层2暴露在开关腔S的底表面上,中间导电膜5a暴露在具有阶梯结构的每个树脂层上。 :(C)2008,JPO&INPIT

著录项

  • 公开/公告号JP2008208431A

    专利类型

  • 公开/公告日2008-09-11

    原文格式PDF

  • 申请/专利权人 SEIKO INSTRUMENTS INC;

    申请/专利号JP20070047137

  • 发明设计人 KISHI MATSUO;NIWA TAKASHI;

    申请日2007-02-27

  • 分类号C25D1/10;C25D1/00;

  • 国家 JP

  • 入库时间 2022-08-21 20:25:57

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