SOLDER BUMP FORMING METHOD, SOLDER BUMP, SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide solder bump, not requiring the washing of flux and capable of forming the solder bump with a narrow pitch, and a semiconductor device electrically connected through the obtained solder bump.;SOLUTION: The forming method of the solder bump comprises a supplying process for supplying a resin composition containing a resin, a flux activating agent and solder powder to the side of one surface of a substrate having an electrode pad or a semiconductor element having the electrode pad, and a forming process for forming the solder bump by heating the resin composition to agglomerate the solder powder around the electrode pad. Further, the solder bump can be obtained through the solder bump forming method. Furthermore, the semiconductor device of this invention can be connected electrically through the solder bump.;COPYRIGHT: (C)2008,JPO&INPIT