MULTI-CHIP LAMINATION SUBSTRATE, MULTI-CHIP LAMINATION MOUNTING STRUCTURE USING THE SAME, AND APPLICATION OF THE SAME

摘要

PPROBLEM TO BE SOLVED: To provide a multi-chip lamination substrate, a multi-chip lamination mounting structure using the same, and an application of the same in which each chip group can independently operate. PSOLUTION: A multi-chip lamination substrate 200 at least has a first wire bonding finger 211, a second wire bonding finger 212, a trace, and a loop wiring. The first wire bonding finger 211 and the second wire bonding finger 212 are adjacent to a die attaching area. The loop wiring is connected in series to the first wire bonding finger 211 and the second wire bonding finger 212, and also connected to the trace. A multi-chip lamination mounting structure includes the substrate 200, a first chip 50 provided in the die attaching area, and a second chip 60 laminated on the first chip 50. PCOPYRIGHT: (C)2009,JPO&INPIT