Experimental evaluation of the E-band multi-chip modules integrated using laminated LCP substrates

摘要

Early results of implementation of System-in-Package integration technique in the E-band using multi-chip module laminated (MCM-L) techniques on multi-layer liquid crystal polymer substrate are presented. Several prototypes have been developed with commercial and proprietary millimeter wave monolithic integrated circuits embedded into LCP MCM-L. Feasibility of this technique has been demonstrated with measured performance close to simulation predictions.