HALOGEN-FREE EPOXY RESIN COMPOSITION, COVER-LAY FILM, BONDING SHEET, PREPREG AND LAMINATED SHEET FOR PRINTED WIRING BOARD

摘要

PPROBLEM TO BE SOLVED: To provide a halogen-free epoxy resin composition having improved physical properties such as adhesive strength to a substrate, electrical insulating properties, flexibility, flame retardance, solder heat resistance and appearance as compared with those of the conventional resin composition. PSOLUTION: The halogen-free epoxy resin composition is provided. The composition is obtained by compounding each of the components of (A) a novolak type epoxy resin having a phenol skeleton and a biphenyl skeleton without containing a halogen, (B) a diaminodiphenyl sulfone, (C) an acrylonitrile-butadiene rubber containing carboxy groups, (D) a curing accelerator containing at least one of organic phosphines and a phosphonium salt, (E) a phosphorus-based flame retardant, (F) a filler containing at least aluminum hydroxide and (G) a phenolic antioxidant as essential components. PCOPYRIGHT: (C)2009,JPO&INPIT