HALOGEN-FREE EPOXY RESIN COMPOSITION, COVERLAY FILM, BONDING SHEET, PREPREG AND LAMINATE FOR PRINTED WIRING BOARD

摘要

PROBLEM TO BE SOLVED: To provide a halogen-free epoxy resin composition assuring required flame retardancy without using a halogen and having sufficient adhesiveness, electric insulation reliability and bending property required for a use for a flexible printed wiring board and the like.;SOLUTION: The halogen-free epoxy resin composition is prepared by compounding components of (A) an epoxy resin having no halogen, (B) a curing agent, (C) an elastomer, (D) a curing accelerator, (E) a flame retardant and (F) a filler. The component (A) contains a novolac epoxy resin having a phenol skeleton and a biphenyl skeleton. The component (B) contains a dicyandiamide. The component (C) contains at least one in acrylonitrile butadiene rubber having a carboxyl group and acryl rubber having a carboxyl group. The component (D) contains at least one in organic phosphines and phosphonium salt. The component (E) contains a phosphorus-based flame retardant. The component (F) contains aluminum hydroxide.;COPYRIGHT: (C)2012,JPO&INPIT