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Sensitivity calibration method of optical inspection apparatus using the calibration standard sample of optical inspection equipment for

机译:使用光学检查设备的校准标准样品的光学检查设备的灵敏度校准方法

摘要

PROBLEM TO BE SOLVED: To inspect a fault on a transparent interlayer insulating film of a surface of a semiconductor wafer with satisfactory sensitivity by arranging a predetermined number of simulated faults of a cubic shape specified in its three-dimensional size by a processing parameter on a surface of a sample and inspecting it by a standard optically inspecting apparatus, thereby actually measuring the sensitivity of the fault. ;SOLUTION: A fault detecting simulator 110 predicts a detection output based on a shape designing data 102 of a simulated fault to obtain a simulated result 106. A simulated fault processing means 111 processes and forms a simulated fault 105 of a cubic shape conforming to the data 102 based on a processing parameter 104 set based on the data 102 of the simulated fault on a surface of a sample. The processed fault 105 is shape-measured by a shape measuring means 112. Actually measured shape data 108 of the measured fault is compared with the data 102 by a comparing means 1001. If a size difference exceeds an allowable range, the parameter 104 is corrected, and the defect 105 is again processed.;COPYRIGHT: (C)1998,JPO
机译:解决的问题:通过在半导体晶片的表面上的处理参数上排列预定数量的以三维尺寸指定的立方体形状的模拟缺陷,以令人满意的灵敏度检查半导体晶片表面的透明层间绝缘膜上的缺陷。通过标准的光学检查设备对样品表面进行检查,从而实际测量故障的敏感性。解决方案:故障检测模拟器110基于模拟故障的形状设计数据102来预测检测输出以获得模拟结果106。模拟故障处理装置111处理并形成符合所述模拟形状的立方体形状的模拟故障105。基于处理参数104的数据102,该处理参数104基于样本表面上的模拟断层的数据102而设置。通过形状测量装置112对加工后的缺陷105进行形状测量。通过比较装置1001将所测量的缺陷的实际测量的形状数据108与数据102进行比较。如果尺寸差超过允许范围,则校正参数104。 ,然后再次处理缺陷105 。;版权所有:(C)1998,JPO

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