The organicity copper compound for organicity metal chemical evaporation and the solution raw materials for copper thin film formation which include this and the copper thin film null following

摘要

PROBLEM TO BE SOLVED: To provide an organic copper compound which is used for metal organic chemical vapor deposition, is scarcely decomposed in a stored state before formed into a film, has a long life, gives an enhanced film-forming speed, can efficiently be decomposed on a substrate, has high evaporability, and has excellent adhesivity to base films. ;SOLUTION: The solution raw material for forming thin copper films comprises a copper+1(allylalkoxysilane)(hexafluoroacetylacetone) or is obtained by dissolving copper+1(allyltrimethylsilane) (hexafluoroacetylacetone), copper+1(trimethylvinylsilane) (hexafluoroacetylacetone) or copper+1(trimethoxyvinylsilane) (hexafluoroacetylacetone) in the copper+1(allylalkoxysilane) (hexafluoroacetylacetone) as a solvent. At least one of allyltrimethylsilane, trimethylvinylsilane, trimethoxyvinylsilane and allyltrimethoxysilane is preferably further added to the solution.;COPYRIGHT: (C)2001,JPO