Being surface process manner of the quartz component which possesses the exposure aspect which is implemented by the plasma central processing unit which does specified treatment, process manner of the quartz component for the plasma central processing unit

摘要

PROBLEM TO BE SOLVED: To provide a method of working quartz member for plasma treatment device by which occurrence of particles in an initial stage and occurrence of chipping thereafter can be suppressed, and to provide a quartz member for plasma treatment device and a plasma treatment device mounted with the quartz member.;SOLUTION: Many cracks 155 occurred in the quartz member 151 for plasma treatment device used for a shield ring, focus ring, etc., after diamond grinding are removed by polishing the surface of the member 151 with abrasive grains having a grain size of #320-400. Thereafter, a smashed layer 163 is removed while recessed and projected sections to which deposits can be adhered and which can hold the adhered deposits are maintained on the surface of the member 151 by polishing the surface of the member 151 with abrasive grains having a smaller grain size.;COPYRIGHT: (C)2003,JPO