The film formation device and the treatment liquid which the uniformity of the film in film formation manner

摘要

PROBLEM TO BE SOLVED: To provide a film forming device for forming a uniform film on a substrate without causing the substrate to be distorted even if the substrate is sucked and retained.;SOLUTION: A main suction port 63 leading to a suction pump 64 is provided at the center of a spin chuck 61. A projection-shaped support 62a is provided radially on the upper surface of the spin chuck 61, and the other parts form a suction 62b leading to the main suction port 63. A sheet 65 made of low- expansion silicone rubber with elasticity is bonded onto the support 62a so that the upper surface of the spin chuck 61 is covered. A suction port 65a is formed at a position corresponding to the suction port 65b in the sheet 65. A wafer W is sucked and retained on the sheet 65 by the suction of the suction pump 64. At this time, since the wafer W is sucked via the sheet 65, the distortion of the wafer W in suction is suppressed, thus improving the uniformity of film thickness when forming the resist film by spin coating.;COPYRIGHT: (C)2001,JPO