Ball capture device and solder ball layout device, ball capture manner, and solder ball configuration method

摘要

This invention captures 1 balls securely from midst of the multiple balls of identical size in regard to the solder ball layout device, and its manner which lay out the solder ball which contains the solder in specified position on the ball capture device, and its manner, and the circuit substrate which capture 1 balls from midst of the multiple balls of identical size. Directing the ball B which is stored in the storage body 111 where the small hole 1111 is provided than the size equivalent to 2 more largely on top of the storage wall 111a which closes airtight the space S which stores the multiple balls B of identical size than as for the size equivalent to 1 of that ball B and storage body 111 to the upper part, it is upwashed by the Fukiage means 112 which it upwashes and Fukiage means 112 it possesses with the capture means 12 which capture the ball B which arrives in the hole 1111.