首页>
外国专利>
After the dry mannered null rinse process of the microstructure body which uses the protecting film lamination
After the dry mannered null rinse process of the microstructure body which uses the protecting film lamination
展开▼
机译:在采用保护膜层压的微结构体经过干式零漂处理后
展开▼
页面导航
摘要
著录项
相似文献
摘要
PROBLEM TO BE SOLVED: To prevent a pattern from being destroyed by preventing the surface of a fine structure of a substrate or the like from being naturally dried in the atmosphere, when the fine structure of the semiconductor substrate is dried after it is developed with a liquefied or supercritical fluid.;SOLUTION: The protective film laminated fine structure is adapted in a process using a liquefied or supercritical fluid before it is dried in a high pressure container, a protective film comprising a highly viscous substance is formed on the surface of the fine structure.;COPYRIGHT: (C)2004,JPO
展开▼