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Electrical Properties of Low-Temperature Processed Sn-Doped In2O3 Thin Films: The Role of Microstructure and Oxygen Content and the Potential of Defect Modulation Doping

机译:低温处理的Sn掺杂In2O3薄膜的电性能:微观结构和氧含量的作用以及缺陷调制掺杂的潜力

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摘要

Low-temperature-processed ITO thin films offer the potential of overcoming the doping limit by suppressing the equilibrium of compensating oxygen interstitial defects. To elucidate this potential, electrical properties of Sn-doped In2O3 (ITO) thin films are studied in dependence on film thickness. In-operando conductivity and Hall effect measurements during annealing of room-temperature-deposited films, together with different film thickness in different environments, allow to discriminate between the effects of crystallization, grain growth, donor activation and oxygen diffusion on carrier concentrations and mobilities. At 200C, a control of carrier concentration by oxygen incorporation or extraction is only dominant for very thin films. The electrical properties of thicker films deposited at room temperature are mostly affected by the grain size. The remaining diffusivity of compensating oxygen defects at 200C is sufficient to screen the high Fermi level induced by deposition of Al2O3 using atomic layer deposition (ALD), which disables the use of defect modulation doping at this temperature. The results indicate that achieving higher carrier concentrations in ITO thin films requires a control of the oxygen pressure during deposition in combination with seed layers to enhance crystallinity or the use of near room temperature ALD.
机译:低温处理的ITO薄膜通过抑制补偿氧间隙缺陷的平衡,具有克服掺杂极限的潜力。为了阐明这种潜力,Sn掺杂的In < msub> 2 O 3 (ITO)根据薄膜厚度研究薄膜。在室温下沉积的薄膜退火过程中,通过测量电导率和霍尔效应,以及在不同环境中使用不同的薄膜厚度,可以区分结晶,晶粒生长,施主活化和氧扩散对载流子浓度和迁移率的影响。在 200 < msup> C 200 C 足以筛选由Al 2 O 3 < / mrow> 使用原子层沉积(ALD),在该温度下将无法使用缺陷调制掺杂。结果表明,要在ITO薄膜中达到较高的载流子浓度,需要与种子层结合以控制沉积过程中的氧气压力,以增强结晶度或使用接近室温的ALD。

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