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Burial on land the aforementioned contact hole on the semiconductor substrate where the many contact hole where
Burial on land the aforementioned contact hole on the semiconductor substrate where the many contact hole where
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机译:将上述接触孔埋在半导体衬底上的地方
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摘要
A method of manufacturing semiconductor device that improves the alignment margin between a contact hole and a device pattern includes a layer having an upper vertically shaped portion and a lower symmetrically inclined shaped portion. That is, the lower portion is tapered.
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