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Megasonic precision cleaning of semiconductor process equipment components and parts
Megasonic precision cleaning of semiconductor process equipment components and parts
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机译:半导体加工设备零部件的超音速精密清洗
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摘要
Methods and apparatus are provided for using various megasonic apparatus including megasonic tanks, scanning megasonic plates, megasonic jets, and megasonic sweeping beams etc., in combination with selective chemistries to remove sub-micron particulate contaminants from the surfaces of the processing equipment used in semiconductor, medical, or any other processing environments.
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