Megasonic Precision Cleaning Of Semiconductor Process Equipment Components And Parts

摘要

Apparatuses are provided for cleaning a processing component using megasonic energy including megasonic jets in combination with selective chemistries to remove sub-micron particulate contaminants from the surfaces of the processing component that is used in cleaning semiconductor, medical, or any other processing substrates. The apparatus includes a processing chamber having a carrier element that is configured to support the processing component. The carrier element includes a mechanism to flip the processing component within the processing chamber during cleaning. A jet assembly equipped with a megasonic transducer is used to provide high frequency megasonic acoustically energized fluid to a surface of the processing component, during cleaning.