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VARIABLE OVERLAP OF DUMMY SHAPES FOR IMPROVED RAPID THERMAL ANNEAL UNIFORMITY
VARIABLE OVERLAP OF DUMMY SHAPES FOR IMPROVED RAPID THERMAL ANNEAL UNIFORMITY
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机译:改善的快速热退火均匀性的虚拟形状的各种重叠
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摘要
Embodiments of the invention provide a method, structure, service, etc. for variable overlap of dummy shapes for improved rapid thermal anneal uniformity. A method of providing uniform temperatures across a limited region of a wafer during a rapid thermal anneal process comprises determining a first reflectivity in a first portion of the limited region by measuring a density of first structures in the first portion. Next, the method determines a second reflectivity in a second portion of the limited region by measuring a density of second structures in the second portion. Specifically, the first structures comprise diffusion fill shapes and polysilicon conductor fill shapes (non-active dummy structures); and, the second structures comprise active circuit structures.
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