VARIABLE OVERLAP OF DUMMY SHAPES FOR IMPROVED RAPID THERMAL ANNEAL UNIFORMITY

摘要

Embodiments of the invention provide a method, structure, service, etc. for variable overlap of dummy shapes for improved rapid thermal anneal uniformity. A method of providing uniform temperatures across a limited region of a wafer during a rapid thermal anneal process comprises determining (400) a first reflectivity in a first portion of the limited region by measuring a density of first structures in the first portion. Next, the method determines (410) a second reflectivity in a second portion of the limited region by measuring a density of second structures in the second portion. Specifically, the first structures comprise diffusion fill shapes (105) and polysilicon conductor fill shapes (115) (non-active dummy structures); and, the second structures comprise active circuit structures.