首页>
外国专利>
Surface mount type light-emitting diode package device and light-emitting element package device
Surface mount type light-emitting diode package device and light-emitting element package device
展开▼
机译:表面安装型发光二极管封装装置和发光元件封装装置
展开▼
页面导航
摘要
著录项
相似文献
摘要
The present invention discloses a surface mount type light-emitting diode package device and a light-emitting element package device. In the device, the encapsulation layer comprises an encapsulation material and at least one material having a refraction index different from the encapsulation material distributed therein. The distribution of the material having a refraction index different from the encapsulation material is in a way such that the refraction index of the encapsulation layer is gradually reduced from the bottom portion upward to the top portion or the inner portion outward to the outer portion of the encapsulation layer. Accordingly, a difference between the refraction indexes of two adjoining media can be reduced to eliminate a total reflection and the Fresnel loss and enhance light extraction efficiency.
展开▼