Plating Target Material, Polyamic Solution And Polyimide Resin Solution Which Are Used To Form The Plating Target Material, And Printed-Wiring Board Using THem

摘要

A plating-target material of the present invention includes a layer-A to be subjected to electroless plating. The surface roughness of the layer-A is such that an arithmetic mean roughness Ra measured at a cutoff value of 0.002 mm is less than 0.5 μm. The 90° anti-peeling adhesive force of the layer-A is 1.0 N/25 mm or less. Furthermore, the layer-A includes a polyimide resin. Further, a plating-target material of the present invention includes the layer-A to be subjected to electroless plating. The layer-A includes a resin, and the sheet containing the layer-A has an elongation modulus of 1.8 GPa or less. The plating-target material of the present invention has a high adhesiveness to an electroless plating film formed on its surface, even if the surface is not so rough, and it is possible to favorably form electroless plating on the entire surface. Accordingly, the plating-target material of the present invention is suitably applicable to manufacturing of a printed-wiring board or the like. Furthermore, the present invention provides a polyamic acid solution, and a polyimide resin solution for use in the plating-target material, and a printed-wiring board made by using them.