Polyamic acid solution used for plating material and the plating material, a printed wiring board formed by using these and polyimide resin solution

摘要

PROBLEM TO BE SOLVED: To provide a material to be plated which can make such an electroless-plated film as to show superior adhesiveness even to the surface with low surface roughness, formed adequately on the whole surface, and can be preferably used for manufacturing a printed wiring board; a polyamic acid solution and a polyimide resin solution to be used therein; and a printed wiring board produced by using them.;SOLUTION: The material to be plated has a layer (A) to be electroless-plated thereon, which contains a polyimide resin having a specific structure. When a sheet is formed of the layer (A), the sheet shows a tensile elasticity of 1.8 GPa or less.;COPYRIGHT: (C)2006,JPO&NCIPI