首页> 外国专利> Method of fabricating surface-emission type light-emitting device, surface-emitting semiconductor laser, method of fabricating the same, optical module and optical transmission device

Method of fabricating surface-emission type light-emitting device, surface-emitting semiconductor laser, method of fabricating the same, optical module and optical transmission device

机译:面发光型发光装置的制造方法,面发光半导体激光器,其制造方法,光学模块和光传输装置

摘要

A method of fabricating a surface-emission type light-emitting device which emits light in a direction perpendicular to a semiconductor substrate, includes the following steps (a) to (e). (a) A step of forming a column-shaped section by etching at least a part of a multilayer film. (b) A step of forming a first resin layer so as to cover the column-shaped section. (c) A step of forming a second resin layer by changing the solubility of the first resin layer in a liquid. (d) A step of immersing, for a specific period of time, at least the column-shaped section and the second resin layer in a liquid in which the second resin layer dissolves, thereby removing the second resin layer at least in the area formed over the column-shaped section. (e) A step of forming an insulating layer by curing the second resin layer.
机译:制造在垂直于半导体衬底的方向上发光的表面发射型发光器件的方法包括以下步骤(a)至(e)。 (a)通过蚀刻多层膜的至少一部分来形成圆柱状的部分的步骤。 (b)形成覆盖柱状部的第一树脂层的工序。 (c)通过改变第一树脂层在液体中的溶解度来形成第二树脂层的步骤。 (d)将至少柱形部分和第二树脂层浸入特定时间段内的步骤,其中至少第二树脂层溶解在液体中,从而至少在形成的区域中除去第二树脂层在圆柱状部分上。 (e)通过固化第二树脂层形成绝缘层的步骤。

著录项

  • 公开/公告号US7324573B2

    专利类型

  • 公开/公告日2008-01-29

    原文格式PDF

  • 申请/专利权人 TSUYOSHI KANEKO;TAKAYUKI KONDO;

    申请/专利号US20050100471

  • 发明设计人 TSUYOSHI KANEKO;TAKAYUKI KONDO;

    申请日2005-04-07

  • 分类号H01S5/028;H01S5/323;

  • 国家 US

  • 入库时间 2022-08-21 20:09:24

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号