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Method for removal of pattern resist over patterned metal having an underlying spacer layer

机译:去除具有下面间隔层的图案化金属上的图案抗蚀剂的方法

摘要

A method of removing the pattern resist that remains on a microchip wafer after etching a patterned layer that is supported by a spacer layer. After the etch, the wafer is cleaned with a develop clean process that removes polymer residues from the pattern resist surface. Next is an ash to remove the hardened pattern resist surface, followed by removal of the pattern resist.
机译:一种在蚀刻由间隔层支撑的图案化层之后去除残留在微芯片晶片上的图案抗蚀剂的方法。蚀刻后,用显影清洁工艺清洁晶片,该工艺可从图案抗蚀剂表面去除聚合物残留物。接下来是灰烬以去除硬化的图案抗蚀剂表面,然后去除图案抗蚀剂。

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