METHOD FOR LASER MICROSTRUCTURING A MATERIAL USING A PROTECTIVE LAYER WITH A THRESHOLD INTENSITY DEFINED BY REFLECTION AND ABSORPTION CHARACTERISTICS

摘要

The invention relates to a method for microstructuring a material, whereby, during a structuring step, material is removed by means of a laser beam comprising a region with increased intensity in the beam cross-section thereof. According to the invention, a protective layer is applied to the surface to be structured before the structuring step is carried out. The threshold intensity defined by the reflection and absorption characteristics is adapted to the laser radiation such that the protective layer only evaporates in the region of the increased intensity during a pre-determined irradiation period, in order to release the material surface below for the structuring.