METHOD FOR PRODUCING A CARRIER PLATE FOR A CIRCUIT, CARRIER PLATE PRODUCED ACCORDING TO SUCH A METHOD, AND CIRCUIT COMPRISING SUCH A CARRIER PLATE

摘要

The invention relates to the production of a carrier plate (1) for a circuit, to be equipped with at least one circuit component. First, a plurality of holes (4) is bored in the carrier plate (1). Then, a first metallic layer (6) is applied to the free surface of the carrier plate (1) and the inner walls of the holes (4). A filling material (7) is then inserted into the holes (4) and hardened. A second metallic layer (9) consisting of a more common metal than that of the first metallic layer (6) is applied to the first metallic layer (6) located on a side to be equipped. The second metal has a lower melting point than the first metal. The second metallic layer (9) is applied by submerging the carrier plate (1) into a chemical bath containing ions of the second metal. In order to form the second metallic layer (9), an upper layer of the first metallic layer (6) is replaced by the second metal. The invention also relates to a carrier plate produced in this way, and a circuit comprising such a carrier plate having an improved coplanarity compared to those of prior art.