ELECTROMAGNETICALLY COUPLED MODULE, WIRELESS IC DEVICE INSPECTING SYSTEM, ELECTROMAGNETICALLY COUPLED MODULE USING THE WIRELESS IC DEVICE INSPECTING SYSTEM, AND WIRELESS IC DEVICE MANUFACTURING METHOD

摘要

Provided is an inspecting system which can speedily and accurately inspect an electromagnetically coupled module and a wireless IC device. An electromagnetically coupled module using such inspecting system and a wireless IC device manufacturing method are also provided. An inspecting system is provided for an electromagnetically coupled module (3) composed of a wireless IC chip (1) and a feed circuit substrate (2) having the wireless IC chip (1) mounted thereon and a feed circuit with an inductance element included therein. The inspecting system measures the electromagnetically coupled module (3) by electromagnetically coupling a probe (5) of a measuring apparatus with the electromagnetically coupled module (3) by electrostatic coupling and/or electromagnetic coupling. Furthermore, the electromagnetically coupled module (3) is manufactured by using such inspecting system.