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System and method for protecting microelectromechanical systems array using structurally reinforced back-plate
System and method for protecting microelectromechanical systems array using structurally reinforced back-plate
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机译:使用结构增强的背板保护微机电系统阵列的系统和方法
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摘要
Disclosed is an electronic device utilizing interferometric modulation and a package of the device. The packaged device includes a substrate 101, an interferometric modulation display array 111 formed on the substrate 101, and a back-plate 130. The back-plate is placed over the display array 111 with a gap 124 between the back-plate and the display array. The device further includes reinforcing structures which are integrated with the back-plate. The reinforcing structures add stiffness to the back-plate. The back-plate may have a thickness varying along an edge thereof.
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