IC CARD MANUFACTURING METHOD BY INTERALLY SEALING THE COMBINATION OF CHIPS AND ELEMENTS BY USING PLASTIC PACKAGE TECHNIQUE

摘要

An IC card manufacturing method by integrally sealing the combination of chips and elements by using plastic package techniques. The method includes the steps below: manufacturing double-face PCB board or multilayer PCB board , adopting new canning process which can integrally seal the combination of several chips and elements by using plastic package techniques in order to form an IC card module and then making it into Plug-in SIM card, or directly integrally sealing the combination of chips and elements in order to form suited size of Plug-in SIM card by using plastic package techniques.