Chip Package Sealing Method.

机译：芯片封装密封方法。

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摘要

A method of manufacturing a package including manufacturing a substrate to include at least one layer of LCP material, manufacturing a cover made of LCP material to include a lower lip, and sealing the cover to the substrate by heating the interface between the lower lip and the substrate.

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作者
Farrell, B.; Jaynes, P.; Taylor, M.;
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年度 2005
页码 1-20
总页数 20
原文格式 PDF
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关键词
Patent applications; Packages; Substrates; Methods; Manufacturing methods; Interfaces; Heating; Chip package sealing;

机译：专利申请;封装;基板;方法;制造方法;接口;加热;芯片封装密封;

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专利

1. New Sealing Technology Enables Real Chip-Sized Packages [J] . Toshimi Kawahara Asia Electronics Industry . 1998 ,第11期

机译：新的密封技术实现了真正的芯片尺寸封装
2. Packaging Unit Dry Meat-Chips in original Packaging Swiss Snack-Ideas with german Packaging - Know-how [J] . Dangel Stefan Fleischwirtschaft . 2015 ,第11期

机译：带有原包装的瑞士零食小包装和德国包装的干肉薄片包装单元-专有技术
3. The DIP may take its final bows: The dual-in-line package, the reigning IC package for several generations, is losing position to newcomers for packaging advanced chips [J] . Bowlby R. IEEE Spectrum . 1985 ,第6期

机译：DIP可能会屈服：双列直插式封装，几代统治性的IC封装，正在失去包装先进芯片的新手的地位。
4. Low Cost Hermetic Sealing of Large Electronic Packages - REDUCE ELECTRONIC PACKAGE SEALING COST BY est. 90 AND ACHIEVE INCREASED RELIABILITY - (PPT) [C] . Thomas E. Salzer IMAPS Advanced Technology Workshop on High Reliability Microelectronics for Military Applications . 2010

机译：大型电子包装的低成本密封 - 通过EST降低电子包装密封费用。90％并实现可靠性增加 - （PPT）
5. Chip package interaction (CPI) and its impact on the reliability of flip-chip packages. [D] . Zhang, Xuefeng. 2009

机译：芯片封装相互作用（CPI）及其对倒装芯片封装可靠性的影响。
6. ChIPpeakAnno: a Bioconductor package to annotate ChIP-seq and ChIP-chip data [O] . Lihua J Zhu, Claude Gazin, Nathan D Lawson, 2010

机译：ChIPpeakAnno：用于标记ChIP-seq和ChIP芯片数据的生物导体包装
7. 11) Diffusion of Gases and Permeability Tests Sealing Papers against Chlorine Gas. (on Sealing Materials for Gas-Proof Rooms and Their Sealing Method.) [O] . Tokusaburo Kato 1939

机译：11）气体扩散和渗透性测试密封纸对氯气。（用于防毒室的密封材料及其密封方法。）
8. In the Matter of Certain Semiconductor Chips with Minimized Chip Package Size and Products Containing Same. Investigation No. 337-TA-605. Volume 2 of 2 [R] . 2011

机译：在具有最小化芯片封装尺寸的某些半导体芯片和含有相同产品的产品中。调查编号337-Ta-605。第2卷，共2页

Chip Package Sealing Method.

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