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A plating-rinse-plating process for fabricating copper interconnects
A plating-rinse-plating process for fabricating copper interconnects
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机译:用于制造铜互连的电镀冲洗电镀工艺
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摘要
An improved copper ECD process. After the copper seed layer (116) is formed, a first portion of copper film (118) is plated onto the surface of the seed layer (116). The surface of the first portion of the copper film (118) is then rinsed to equalize the organic adsorption on all sites to prevent preferential copper growth in dense areas. After rinsing, the remaining copper of the copper film (118) is electrochemically deposited.
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