METHOD FOR MOUNTING A PRINTED CIRCUIT BOARD ON A BASEBOARD, AND AN ARRANGEMENT, WHICH IS PROTECTED AGAINST SHORT CIRCUITS, OF A PRINTED CIRCUIT BOARD ON AN ELECTRICALLY CONDUCTIVE BASE BOARD.

摘要

The subject matter of the present invention is an electrical composite comprising an electrically conductive baseboard and a printed circuit board mounted on it, which has an electrically insulating adhesive layer between the printed circuit board and the electrically conductive base board. In this case, this adhesive layer is stamped separately, and the stamped adhesive layer is then applied to the baseboard or to the printed circuit board. The assembled pack comprising the printed circuit board, the adhesive layer and the baseboard is then joined together to form the composite, with the adhesive layer, according to the invention, projecting beyond the printed circuit board, at least in the area of the stamped edges. This measure according to the invention results in an insulating layer being produced between the printed circuit board and the baseboard when the composite is joined together, which insulating layer can advantageously prevent the feed conductor tracks, which project or are smeared because of the stamping process, from making contact with the baseboard.