THERMALLY ENHANCED QUAD FLAT NO LEADS (QFN) IC PACKAGE AND METHOD

摘要

Methods for assembling thermally enhanced semiconductor device packages (20) are disclosed in which a flip-chip assembly has a chip affixed to a leadframe (22). A thermal pad (30) is affixed to a surface of the chip (26), and the flip-chip assembly is encapsulated whereby a surface of the thermal pad remains exposed to form at least a portion of a surface of the package favorable for the egress of heat from the chip. Also disclosed are thermally enhanced semiconductor device packages made using the methods of the invention.